China’s CXMT Begins Mass Production on New Memory-Chip Process Platform Hefei-based memory-chip maker CXMT said it had reduced the spacing between key structures in the chip’s data-storage region to 11.95 nanometres (nm), or approximately 12 billionths of a metre. The company achieved this using “quadruple patterning,” a technique that repeats multiple manufacturing steps to create finer circuit patterns. According to CXMT, the platform can produce at least 50% more gross dies per wafer than its fourth-generation platform, based on an 8-gigabit (Gb) chip. The company said it developed the platform using computer simulations and collaboration with Chinese semiconductor-equipment manufacturers on critical production steps.