1)This is true , because no BSPDN has to run tighter pitches have to use double patterning EUV
2)High NA EUV use industry standard 6x6 mask and then stitching has already been extremely derisked with the XT260 system
3)18A indeed outpacing A16 on BSPDN
First glass core substrate with EIMB AI package leadership
1)Focus on No SeWaRe -> microcracks and fragmentation occur during cutting and handling ,Glass is a brittle material
2)10-2-10 stacked structure
3)800μm (0.8mm)->Thick Core
4)45μm bump pitch