Agree here with @ren_stocks: The more I study the HBM4 ramp, the more bullish I get on $PDFS: > HBM4 is not just a supply problem, it is also a yield problem. > Memory is getting more complex: more dies per stack, more bonding steps, more test steps, more packaging complexity, and more points of failure across the manufacturing flow. Implication? That creates a lot more data. > And if you are trying to ramp a complex product like HBM4, that data becomes extremely valuable. You need to know where defects are happening, why yield is breaking, and how to fix the process faster. That is my $PDFS thesis: > It helps semiconductor companies connect manufacturing and test data, understand yield issues, and improve the ramp from development to high-volume production. > If AI memory keeps getting harder to manufacture, the software layer that helps companies improve yield and control the process becomes more important.