Jeff Pu(@sssjeffpu ):# 3D Packaging & **Onto Innovation (ONTO TP $397) Note * **Outlook:** 2026 revenue guided at **$1.3bn**; capacity supports **$2bn** by 2027. ### **3D Packaging Trend** We expect the shift to 3D for Nvidia Feynman, AWS Trainium, and Google V9 (Broadcom). * **Capacity Surge:** We forecast TSMC SoIC capacity to be 15KPM and 35KPM by end of 2026 and 2027. * **Tools:** **G5/3Di** tool shipments expected to jump from ~30 units in 2026 to >100 units in 2027. #ONTO

Jeff Pu

@sssjeffpu

Tech Enthusiast. 20 years tech equity research + industry. GF Securities Technology Research.

Joined April 2025

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Jeff Pu@sssjeffpu

2026.05.06 12:55

# 3D Packaging & **Onto Innovation (ONTO TP $397) Note * **Outlook:** 2026 revenue guided at **$1.3bn**; capacity supports **$2bn** by 2027. ### **3D Packaging Trend** We expect the shift to 3D for Nvidia Feynman, AWS Trainium, and Google V9 (Broadcom). * **Capacity Surge:** We forecast TSMC SoIC capacity to be 15KPM and 35KPM by end of 2026 and 2027. * **Tools:** **G5/3Di** tool shipments expected to jump from ~30 units in 2026 to >100 units in 2027. #ONTO#