StatementDog | AI & Tech Supply Chains(@statementdog):Foxconn Interconnect Technology (FIT) is showcasing a 480kW liquid-cooled busbar system for power distribution within AI racks at the 2026 OCP Global Summit. Its lineup also includes a 12.8T XPO platform that combines electrical and optical connections with direct liquid cooling, as well as a liquid-cooling design for switches with 32 OSFP ports. The announcement does not disclose customer orders, shipment volumes or commercial deployment dates for these products.

StatementDog | AI & Tech Supply Chains

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StatementDog | AI & Tech Supply Chains@statementdog

2026.10.15 03:27

Foxconn Interconnect Technology (FIT) is showcasing a 480kW liquid-cooled busbar system for power distribution within AI racks at the 2026 OCP Global Summit. Its lineup also includes a 12.8T XPO platform that combines electrical and optical connections with direct liquid cooling, as well as a liquid-cooling design for switches with 32 OSFP ports. The announcement does not disclose customer orders, shipment volumes or commercial deployment dates for these products.