📢 Packaging is emerging as a key growth driver for #AppliedMaterials#, with the company targeting >50% growth in 2026. Semiconductor equipment is also seen rising >30% YoY, supported by strength in memory tools led by DRAM wiring.💡More: 🔗
APPLIED MATERIALS, INTEL TO CO-DEVELOP NEXT-GEN AI CHIP TECHNOLOGY
$AMAT and $INTC are expanding their R&D partnership to develop next-generation transistors, interconnects and advanced packaging for AI chips.
The work will span Applied’s new EPIC Center and Intel’s Oregon R&D campus, including development around Intel’s Foveros 3D stacking technology, with the goal of moving new AI-focused semiconductor technologies into high-volume manufacturing faster.
APPLIED MATERIALS CEO: SERVICES BUSINESS GROWING MORE THAN 20% Y/Y WITH MARGINS UP 180BPS; PACKAGING BUSINESS EXPECTED TO GROW MORE THAN 70% THIS YEAR.