#AppliedMaterials# is doubling down on #hybridbonding#, planning to raise its stake in #BESI# from 9% to 20%. The Dutch firm reportedly holds around 70% of the global hybrid bonding equipment market.💡More: 🔗

What if chips could be stacked without bumps? 🤔Hybrid bonding could reshape next-generation #HBM# by connecting chips without bumps, enabling denser connections, faster signal transmission, and better heat dissipation. 🔗 #SKhynix# #HybridBonding#

- Hybrid bonding reduces chip-to-chip pitch below 1µm versus 20µm for microbumps, enabling higher connection density and bandwidth critical for AI systems. - Technology already commercialized in CIS sensors, NAND flash, and logic ($AMD V-Cache); SK hynix targeting 400+ layer NAND with hybrid bonding by 2027. - Hybrid bonding delivers 11.9x speed, 100x+ heat dissipation, and 15x integration density improvements over TCB, becoming foundational for HBM and AI accelerators. Hybrid bonding is transitioning from niche sensor/logic applications to foundational HBM and AI accelerator packaging technology, with sub-1µm pitches enabling the 3D stacking architectures required for next-generation AI infrastructure.

Hybrid bonding is becoming increasingly important for next-generation 3D NAND and HBM. This workflow shows why the process is much more than simply “bonding two dies together.” It involves temporary bonding, wafer thinning, protection layers, precision dicing, die pick-and-place, hybrid bonding, and final debonding/cleaning. As HBM moves toward higher stack counts and tighter interconnect pitches, wafer handling, temporary bonding/debonding, surface preparation, alignment accuracy, and yield control will become increasingly critical. Advanced packaging is becoming a full process ecosystem of its own.

TrendForce maps the companies supplying bonding equipment Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging $BESI and ASMPT ( have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding SUSS ( appears across both hybrid-bonding formats for memory