#Infineon# and #NVIDIA# are expanding their collaboration on #GaN-based# power solutions for 800V DC AI data centers, paving the way for 1 MW+ racks as NVIDIA targets adoption from 2027!💡More: 🔗

Korean media report that U.S. startup Palomino recently received its first purchase order from a strategic customer, a global hyperscaler, for GaN microLED-based optical interconnect chips for AI infrastructure. First commercial use of microLED chips for optical interconnects?

🔔 The Daily Semi-Cap — September 16, 2026 📊 SMH: $545.56 (+0.64%) 📈 Earnings: • ALMU — $0.58M rev (est $0.58M), $(0.15) adj. EPS (est $(0.07)). GM 25.6%, -55.8% YoY. Management gave no numerical FY27 outlook as it prioritizes product development and AI-datacom customer engagements; cash reached $56.0M after a $20.1M equity raise. Shares fell roughly 5.5% after hours. 🔥 Major Developments: • Apple is developing enterprise AI inference servers powered by its own chips and has discussed using Nvidia’s NVLink Fusion networking, potentially bringing Apple silicon back into the server market it exited years ago. • Onsemi unveiled its Embedded Power Platform, which uses the silicon wafer itself as the package to integrate silicon, SiC and GaN devices. The company targets 3–5x higher power density; an early AI-infrastructure circuit breaker was about 50% smaller and 20% cooler than existing designs. • Google, Nvidia, Anthropic and 17 energy-sector partners launched the AI Energy Management Alliance to make data-center electricity demand more flexible, pairing hyperscalers with utilities and power producers including National Grid, AES, Constellation, NRG and RWE. • Schneider Electric launched standardized 2–2.5MW prefabricated power modules based on Nvidia GB300 NVL72 reference designs, integrating UPS, batteries and liquid-cooling controls while cutting targeted manufacturing lead times to six months from 12–14 months.

FUTURUM'S FOUR LAYERS OF AGENTIC AI ECONOMY APPLICATIONS & AGENTS LAYER • $META scaling consumer agents through Muse & specialized models • $AXON putting AI on officers cameras with AI ARR now above $100M • $GOOGL bringing Gemini agents across Search, Android & Workspace • $MSFT distributing Copilot agents across world's largest enterprise customer base • $APP using next-gen AI models to price & target ads across gaming & e-commerce • $SHOP plugging merchants into every major shopping agent as AI-driven orders grow 3x • $PLTR giving AI agents operating context to act on real enterprise data through its ontology INFERENCE PLATFORMS & CLOUD LAYER • $IREN owning land, power & data centers under its AI cloud • $MSFT $AMZN $GOOGL $ORCL running largest AI clouds in world • $NBIS building vertically integrated AI cloud with zero Texas exposure • $CRWV providing specialized GPU cloud capacity for hyperscalers & labs • $NET running agents on isolates instead of containers as "the first agentic cloud" • $DOCN offering a simpler cloud for developers as AI agents start choosing infrastructure COMPUTE, NETWORKING, MEMORY & TIMING LAYER • $MU $SKHY supplying memory every AI system is short on • $CBRS delivering speed for inference with wafer-scale chips • $AVGO supplying Ethernet & custom AI chips for hyperscalers • $AEHR testing expensive chips before they go into production • $CRDO adding high-speed links as AI systems spread across more chips • $NVDA supplying accelerators, networking & software for AI infrastructure • $SITM keeping every chip, switch & optical link in sync with precision timing • $ARM collecting royalties on nearly every CPU challenging x86 in data center • $AMD powering agents with EPYC CPUs & Helios racks alongside Instinct GPUs • $ALAB connecting accelerators with content per chip roughly doubling each generation • $MRVL supplying custom AI chips & optical DSPs with its pending $LITE deal adding in-house lasers POWER, COOLING & PHYSICAL INFRASTRUCTURE LAYER • $GEV building gas turbines for self-powered campuses • $CEG $VST pairing data centers directly with nuclear power • $NVTS bringing GaN power chips into 800V AI data centers • $FPS supplying electrical gear that every power scenario needs • $BE generating on-site power for data centers that can't wait for grid • $VRT cooling & powering racks that get hotter & denser every generation • $ON converting power efficiently as data centers move to 800V architectures

🚨 Two Chinese Sailors Died Ramming Manila’s Boat. Beijing Hid It for a Year. On August 11, 2025, in broad daylight and calm seas off Scarborough Shoal, China Coast Guard (CCG) cutter 3104 slammed into the People’s Liberation Army Navy (PLAN) Type 052D destroyer Guilin (hull 164) at high speed. Both were chasing the Philippine Coast Guard (PCG) vessel BRP Suluan, a 44-meter Parola-class patrol vessel on a lawful resupply mission inside Manila’s exclusive economic zone. Philippine video captured the 3104’s bow crumpling ten meters inward. Four CCG sailors visible on that bow moments earlier were gone. Beijing said nothing. CCG spokesman Gan Yu called it “professional, regulated, and legitimate.” Censors scrubbed the footage from Weibo. Filipino radio calls offering medical aid went unanswered. Guilin kept chasing the Suluan before limping away for repairs at Yulin Naval Base. A year later, the cover-up cracked. On August 5, 2026, state broadcaster China National Radio’s (CNR) military channel posthumously named four “martyrs” as “Loyal Guardians of the China Armed Police”. The Ministry of Veterans Affairs martyr database confirms two, Yi Xinyu (born 2003) and Cheng Long (born 2000), were killed on August 11, 2025 during “frontline rights protection operations” in the South China Sea. Beijing’s own paperwork betrayed the story it spent a year burying. This was not seamanship. Since 2018, the CCG has reported through the People’s Armed Police (PAP) to the Central Military Commission (CMC). Two ships coordinating a high-speed block against a civilian resupply run is an ordered operation, not a rogue captain. The world responded. Then-US Ambassador MaryKay Carlson condemned the “reckless action.” Japan, Australia, New Zealand, and the European Union raised alarm. Two days later, USS Higgins and USS Cincinnati sailed Scarborough Shoal on a freedom of navigation operation. Beijing killed two of its own to intimidate a neighbor, then hid the bodies until its own paperwork told on it. ACI — Aric Chen | Insights

Say Gan Bei 干杯! It means cheer! ❤️ 💌 This is my previous Patreon theme, if you are interested to get more pictures, DM me ya! #justsushii# #cosplaygirl# #asiangirls# #casualoutfitsdaily# #singlet# #bööbs# #cute# #animelover# #sëxy# #curveygirls# #kawaiistyle#

Northrop Grumman Rebrands Wideband GaN Technology as FORTITUDE, Targets RF System Integration - #semiconductordigest# #semiconductors# #semiconductor# #semiconductorindustry# #semiconductorwebsite# #semiconductormagazine#

DS Investment & Securities: SiC & GaN Market Growth & Opportunities: > The adoption of 800V architectures creates new growth opportunities for 8inch foundries, challenging traditional Si power semiconductors. > SiC Power Market: Expected to grow at a CAGR of +20%, scaling from $3.4 billion (2024–2025) to $10.3 billion by 2030F. > GaN Power Market: Expected to experience even faster growth at a CAGR of +44%, rising from $0.6 billion to $3.0 billion by 2030F. Role Breakdown & Material Specialization: > SiC: Excels in high-voltage, high-power, and high-temperature environments, serving as a partial substitute for Si IGBT. Main applications include EV inverters/OBC, 800V EVs, AI datacenters (AI DC), and energy storage systems (ESS). > GaN: Excels in high-frequency, high-power-density, and high-efficiency power conversion, serving as a partial substitute for Si MOSFETs. Key application areas include chargers, adapters, power supply units (PSU), AI datacenters, robots, and solar power. Infrastructure & Trends: > Datacenter Penetration: The penetration rate of SiC/GaN within datacenter power systems is projected to increase from 17% in 2026F to over 30% by 2030F, driven heavily by new high-frequency, high-density conversion needs (such as 800V to 54V/12V transitions in AI datacenters). > Manufacturing Shifts: SiC is currently transitioning from 6-inch to 8-inch fabrication lines, while GaN relies heavily on 8-inch GaN-on-Si processes. Long-term transitions up to 12-inch wafers are also being evaluated.