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Samsung Electronics (KRX: 005930) is now up 50% from its recent low The semiconductor cycle is heating up again, while Samsung’s HBM story is shifting from catch-up to scale-up HBM4 yields have reportedly reached ~80%, with HBM4/HBM4E production expected to at least double next year AI memory is becoming a bigger part of the Samsung story Samsung Electronics is available to trade on StableStock: → #SamsungElectronics# #HBM# #AI# Not investment advice. For informational purposes only.

Yageo, Taiwan’s biggest passive component maker, said demand for AI server components remains 'very, very strong', leading some customers to pay a premium to secure supply and sign Long Term Agreements (LTAs), media report, adding Yageo raised prices in the 2nd quarter to keep pace with rising materials costs, and may have to raise prices again. #Yageo# #TaiyoYuden# #SamsungElectroMechanics#

Samsung aims to complete development of 3D Cube-H, its hybrid bonding technology for 3D logic chips, by early next year, according to Korean media reports. The technology is primarily intended for ultra-high-performance AI chips. Korean media said that if Samsung succeeds, it could strengthen its competitive position in next-generation AI chips and lay the groundwork for winning Big Tech customers for its foundry business.

Samsung says memory shortages will get worse in 2027, and supply constraints will persist into 2028, with up to 70% of capacity secured by long-term agreement customers. 🔗

Samsung's advanced EUV process leak mentions temperature and a solvent. There are 2 places this could be used, both for Metal Oxide Resist (MOR). Heated solvent developer has been published on for this, although AFAIK no benefit has been observed yet. And industry is leaning toward dry develop anyway which has clear benefits. Edge Bead Removal (EBR) for wet MOR. In the spin coat process, the photoresist at the edge of the wafer needs to be cleaned off in the track to prevent contamination of the robotics that grip the wafer. It's very hard to clean MOR with a solvent; it leaves trace metals behind. Since a single metal atom could kill a chip, this is a problem. There are 2 ways the industry is dealing with this now. One is a formulated EBR solvent plus an acid. It's unclear whether this will prove to be 100% reliable. The other is an expensive edge protection layer process that protects the wafer edge before MOR is coated. This is known to work, but it adds a lot of extra steps and cost. So a heated, formulated EBR chemical could also be used to enhance the first method. I've not seen anything on this yet; it would be a brand-new process tech.