Yageo, Taiwan’s biggest passive component maker, said demand for AI server components remains 'very, very strong', leading some customers to pay a premium to secure supply and sign Long Term Agreements (LTAs), media report, adding Yageo raised prices in the 2nd quarter to keep pace with rising materials costs, and may have to raise prices again. #Yageo# #TaiyoYuden# #SamsungElectroMechanics#

Samsung just became the first to validate LPDDR6 on a Snapdragon. The 16GB chip hit 10.7Gbps on Qualcomm's Snapdragon 8 Elite Extreme Gen 6, with power efficiency up 21% over LPDDR5X. Samsung says sample supply and quality validation are done and it's ready to ship on customer schedules. Meanwhile China's CXMT announced LPDDR6 in mass production earlier this month at 12.8Gbps, faster than the 10.7Gbps baseline, and Xiaomi's 18 Fold with its own XRING O3 will be the first platform to use it. On the Galaxy side, Samsung may split memory tiers: testing Micron's 1 gamma LPDDR5X for the S27 and S27 Plus while keeping LPDDR6 for the Ultra and Pro

Samsung Securities: Key Terafab Beneficiaries Terafab initially plans to leverage Intel's 14A process technology and supply chain, as a result, these global and domestic equipment vendors are positioned as key early beneficiaries. $ASML $AMAT $LRCX $KLAC $INTC $SPCX

Samsung Electro-Mechanics × Qualcomm: Organic Bridge for AI Packaging Samsung Electro-Mechanics and Qualcomm are reportedly developing Organic Bridge technology for high-density interconnects between logic and HBM in AI/HPC packages. Unlike Intel’s EMIB, which uses an embedded silicon bridge, the approach integrates fine-pitch interconnects directly into the organic substrate, targeting lower cost and simpler processing. 2.5D → 2.1D L/S: 9/12 μm → 2/2 μm The key trend: organic substrates are moving closer to interposer-level interconnect density.

#Samsung’s# HBM4 Yield Reportedly Reaches 80%: Competition Is Shifting From “Technology Catch-Up” to Volume Expansion South Korea’s Seoul Economic Daily reported on September 20, citing industry sources, that Samsung Electronics’ HBM4 yield has improved from below 60% during the initial mass-production stage to approximately 80%. Samsung is now reportedly planning to increase its overall HBM monthly wafer input from around 180,000 wafers in 2026 to approximately 250,000 wafers in 2027, representing an increase of nearly 40%. The key shift is clear: the HBM4 race is moving beyond technology qualification and yield improvement toward large-scale capacity expansion and customer allocation.