Samsung is reportedly developing next-gen HBM packaging for mobile on-device AI. According to ETNews, Samsung is working on “Multi Stacked FOWLP,” combining advanced copper-pillar stacking with fan-out wafer-level packaging. Today’s mobile LPDDR still uses copper wire bonding, which limits I/O to roughly 128–256 terminals and creates signal-loss, thermal, and power-efficiency bottlenecks. Samsung’s VCS technology improves this by stacking DRAM dies in a staircase structure and connecting them with copper pillars. The new approach appears to push that further, aiming to bring HBM-like bandwidth closer to mobile devices.

Samsung and its South Korean labor union are set to join a new round of government-mediated pay talks on May 18, in a bid to avert a strike at the tech giant, which accounts for nearly a quarter of the country's exports. More here:

Samsung Shuts Down Messages—Apple Changes iPhone After 15 Years That iOS update is likely due on May 11 or May 12, suggests David Phelan, noting that the update "that makes this version so important, is the introduction of end-to-end encrypted messaging with RCS.”

🚀 #Samsung# is reportedly working on next-gen mobile #HBM# packaging using ultra-high-aspect-ratio copper pillars and FOWLP, with bandwidth gains said to reach 15%–30%.💡More: 🔗

👀 #Samsung# is quietly rebalancing its #MicroLED# strategy — maintaining near-term investment while focusing more on profitability, with wearables and AR/VR reportedly emerging as its next big bet. 💡More: 🔗