At #SEMICONWest#, Lalitha Immaneni, VP of Semiconductor Research and Development at Intel, will discuss the future of advanced packaging during the CEO Summit Keynote. Register here: #IntelFoundry#

Semiconductor innovation takes an ecosystem. At #SEMICONWest#, Intel Foundry experts shared how advances in packaging, materials, metrology, and AI-enabled insights are helping bring innovation to scale with the quality and consistency that customers demand. #IntelFoundry#

AI needs faster, more efficient connectivity. Co-packaged optics (CPO) brings optics closer to compute, but scaling it reliably takes advances in manufacturing and packaging. At #SEMICONWest#, Intel Foundry highlighted the collaboration needed to scale CPO for AI infrastructure. #IntelFoundry#

#CPO# #NVIDIA#'s Optics on Interposer moves optical engines from the package substrate to the interposer, which could raise bandwidth density and cut power. Nikola Nedovic presented it at #SEMICONWest# 2026; NVIDIA says a prototype exists. $NVDA #OOI#

Missed a booth at SEMICON West? We've got you covered. Throughout the show at Moscone Center, Semiconductor Digest Editor-in-Chief Pete Singer sat down with industry leaders to talk about their latest announcements, the technologies they're betting on, and the challenges facing chipmakers today. Our SEMICON West Video Showcase brings those conversations together in one place - grab a coffee, press play, and see what's shaping semiconductor manufacturing. Watch now - #SEMICONWest# #Semiconductors# #SemiconductorManufacturing# #Video#

The future of semiconductor manufacturing depends on connected intelligence. Explore how metrology, AI, automation, and advanced packaging strategies can work together to improve yield, efficiency, and manufacturing autonomy. Read more: #IntelFoundry# #SEMICONWest#

During SEMICON West 2026, Soitec highlighted LT memory applications as a high-upside opportunity, but advised investors not to include them in current estimates because the likelihood of it materializing is still uncertain.

ClassOne Solstice Max at SEMICON West ClassOne showcased its Solstice Max at SEMICON West. The 200/300mm single-wafer platform integrates electroplating, wet etch, strip and cleaning, and scales from 4 to 16 chambers. It targets advanced packaging metallization. Source: SEMICON West booth

$TER: Rubin Test Times Are Nearly Twice Blackwell’s At SEMICON West, $TER told Goldman Sachs ($GS) that test times for $NVDA’s Rubin are nearly twice Blackwell’s, according to the bank’s October 14 research note. The implication: even unchanged GPU shipment volumes could require more testing capacity if each device occupies equipment longer. That gives $TER a potential demand driver beyond unit growth. Actual equipment demand still depends on parallel testing, utilization and test-program optimization. Source: Goldman Sachs ($GS), SEMICON West 2026 research note, October 14, 2026.

Semiconductor equipment: The outlook for 2027-2028 continues to improve. A few interesting developments across the semiconductor supply chain following SEMICON West 2026. The overall message is encouraging, particularly for investors exposed to memory, advanced packaging, semiconductor equipment and optical connectivity. Here are my main takeaways: 🟢 1. Visibility into 2027–2028 is improving. Equipment suppliers are receiving customer forecasts much earlier than usual, allowing them to prepare capacity and secure components. Some manufacturers are already planning for a wafer fabrication equipment (WFE) market exceeding $300B in the coming years. This would represent a substantially larger industry than previous cycles. 🟢 2. AI demand continues to broaden. There has been considerable discussion around AI systems requiring less HBM per accelerator, particularly for inference. However, lower memory capacity per individual system does not necessarily mean lower aggregate memory demand. Training remains memory-intensive, while inference is becoming increasingly specialized. Higher deployment volumes, greater bandwidth requirements and additional memory architectures could support continued growth across HBM, conventional DRAM and other memory products. 🟢 3. Advanced packaging is becoming increasingly important. As semiconductor architectures become more complex, manufacturers need additional inspection, metrology, bonding and testing equipment. At 2nm/GAA, process-control intensity could increase approximately 30% compared with equivalent 3nm capacity. This creates opportunities for companies such as $KLAC, $NVMI, $CAMT and $AMAT. Importantly, these businesses can benefit from increasing manufacturing complexity even without equivalent growth in wafer volumes. 🟢 4. Memory technology transitions provide another growth opportunity. Beyond HBM capacity expansion, the industry is preparing for hybrid bonding, 4F² DRAM architectures, taller memory stacks and increasingly complex NAND structures. These transitions require more sophisticated deposition, etch, metrology and process-control equipment. That is encouraging for suppliers such as $LRCX, $AMAT, $KLAC and $MKSI. NAND investment has also remained relatively limited compared with DRAM/HBM, leaving room for additional spending if manufacturers eventually expand capacity. 🟢 5. Silicon photonics is emerging as another significant opportunity. Increasing AI bandwidth requirements are driving interest in silicon photonics, optical interposers and eventually co-packaged optics. Soitec's photonics capacity for 2027–2028 is effectively booked, while $CAMT expects a more meaningful silicon photonics contribution beginning in 2028. $TER is also positioning itself for increasing optical testing requirements. The optical transition is still relatively early, but the investment opportunity extends beyond transceiver and laser manufacturers. 🟢 6. Power requirements continue to increase. AI rack power requirements are moving substantially higher, creating opportunities for precision power conversion and delivery. $AEIS expects another 1–2 generations of higher-power 48V products before the 800V transition becomes meaningful in late 2028 or 2029. 🟢 7. Pricing power is improving across equipment suppliers. More advanced equipment delivers better yields, greater throughput and improved manufacturing efficiency. These capabilities support higher selling prices and potentially better margins. At the same time, some supply-chain components remain constrained, which could limit how quickly manufacturers respond to demand. Key takeaways: The semiconductor investment opportunity is becoming broader than simply forecasting how many GPUs hyperscalers will purchase. Increasing manufacturing complexity, higher memory requirements, more advanced packaging, optical connectivity and power delivery are all creating opportunities across the supply chain. What I find particularly interesting is that several equipment suppliers could benefit from multiple technology transitions simultaneously. The biggest question remains whether demand can sustain the industry's increasingly ambitious capacity plans. But the visibility companies are reporting for 2027–2028 is certainly encouraging.