MojoTrick(@MojoTricks):Micron just laid out its full memory roadmap through 2030. • DDR6: >2× bandwidth vs DDR5 • LPDDR6: >35% better power efficiency (1δ node) • HBM5 (2028) → HBM5E (2029) → HBM6 (2030) • vHBM with hybrid bonding starting 2028 • G11 NAND: >400 layers, 2× density vs G9, ramp in 2H27 Vertical stacking is coming. The memory wall is real. #Micron #HBM #DDR6 #NAND #AI #Semiconductors $MU

MojoTrick

@MojoTricks

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MojoTrick@MojoTricks

2026.10.22 08:54

Micron just laid out its full memory roadmap through 2030. • DDR6: >2× bandwidth vs DDR5 • LPDDR6: >35% better power efficiency (1δ node) • HBM5 (2028) → HBM5E (2029) → HBM6 (2030) • vHBM with hybrid bonding starting 2028 • G11 NAND: >400 layers, 2× density vs G9, ramp in 2H27 Vertical stacking is coming. The memory wall is real. #Micron# #HBM# #DDR6# #NAND# #AI# #Semiconductors# $MU