TSMC plans to start using High-NA EUV in 2030, when it expects the technology to be mature, C.C. Wei said on the company’s Oct. 15 earnings call.
Asked whether adopting it later than rivals would put TSMC at a disadvantage, Wei said new tools must offer advanced technology at a reasonable cost and be mature enough for mass production.
TSMC is also working with ASML on 12-inch photomasks, targeting 2031. Wei expects High-NA to be cost-effective enough for mass production at that point.