Is $INTC about to be “super successful?” When they were asked on their July 23rd earnings call about the need to raise capital, which they are doing this morning with their $15B common stock offering, this is how the CFO answered: “we feel like we're in a really good place from a balance sheet perspective. We have over $30 billion of cash. We have a $10 billion revolver. So, we've got $40 billion of liquidity… Obviously, the fact that revenue and profitability and EBITDA are all expanding helps a lot in terms of the cash flow that throws off to the business. And additionally, we have… roughly, call it $10 billion of what it's called non-core assets that can still be monetized on the balance sheet… And we have seen, by the way, our customers willing to invest with us. And we've had pre-pays from customers… that has enabled us to unlock capacity that's helped us. That said, if we're super successful, which we're driving to, we may need to tap the capital markets to drive…some more investment.” My belief of what “super-successful” means is they are close to signing up one or more major foundry customers, which is very capital intensive, and they need a lot more capacity to ramp it. I expect more details from industry sources to come out over time given a press release is unlikely given the secrecy demanded by most customers. I believe with Intel, there are multiple ways to win: 1) higher ratio of CPUs to GPUs in Agentic, 2) advanced packaging and 3) US national champion in foundry. This offering today increases my conviction they are on the path to being “super successful.”

Advanced Micro Devices $AMD is in positive gamma into Nov 6 earnings after hours, with GEX ratio at 0.80 (+0.8σ) and net GEX at 34.1K. Net premium is +$6.2M and flow ratio is 0.53 (+1.5σ), with zero gamma at 497.61 and the largest call OI stacked at 600.

"Advanced Bounty: Area Patrol" Event Details Event Duration 2026/11/04 04:00 (server time) – 2026/11/09 03:59 (server time) Requirements Reach Inter-Knot Lv. 21, complete the Reputation Rank-Up Mission "Path of the Proxy I", and unlock Area Patrol to participate Event Details • During the "Advanced Bounty: Area Patrol" event, Proxies can go into Area Patrol and clear any stage to obtain double rewards! • During the event, 2 challenges will be buffed each day. Buffs will be reset daily at 04:00 (server time). #zzzero# #zenlesszonezero#

#AdvancedPackaging#: TSMC says nobody else is in production at 5X reticle size — and C.C. Wei hints TSMC will step in if EMIB-T falls short From TSMC's 3Q26 #EarningsWatch# call (10/15), the CoWoS, Intel EMIB-T and GlobalFoundries exchanges in the speakers' own words: 🔹 Q (Charlie Chan, Morgan Stanley): "From what we're seeing, the reticle size is getting much bigger. … If some customer, they initially choose to use Intel's EMIB-T, and for some reason cannot get to sufficient demand, are you okay to bail out or support customers for the CoWoS version or capacity?" A (C.C. Wei, Chairman & CEO, TSMC): "So far, let me share with you today's situation. We are in the real-world production of 5X reticle size. I don't believe that anybody can do that today except TSMC, and the yield is excellent. So our customers are very satisfied with the result. And then we are working on the 9X reticle size and moving into the 14X reticle size. … But so far, CoWoS is still the number one choice for our customer. As time goes by, yes, our competitor offers a very competitive solution." 🔹 Backup plan? Jeff Su, TSMC IR: "If the competitor cannot deliver on their solution … will you be willing to be something like a backup plan?" C.C. Wei: "I try to avoid to answer it directly, but let me say that, yes, we will be. … Okay? And that gives you enough hint." 🔹 Q (Sahith Singh, Stifel Financial): "There was the announcement via GlobalFoundries that they would be providing silicon interposers to TSMC. And so I would love some color into how you're thinking through these strategic decisions in terms of procuring from some of the specialty foundries versus providing in-house." A (C.C. Wei): "We designed a deal with GlobalFoundries, and this is part of our overall strategy in the back-end supply. … Definitely, we have a little bit shortage on the back end, and we would like to work with our so-called partner with GlobalFoundries so that both TSMC and GlobalFoundries can support TSMC's customer for their product to be introduced with enough support on the capacity." 💡More: 🔗 $TSM $INTC $GFS

Advanced packaging is no longer just about adding CoWoS capacity. It is becoming a global manufacturing ecosystem. TSMC’s reported $2 billion, five-year manufacturing agreement with GlobalFoundries highlights an important shift in the AI semiconductor supply chain. Under the agreement, GlobalFoundries is expected to manufacture silicon interposers for TSMC at its Malta, New York facility, with production ramping up in 2028. The significance goes beyond geographic diversification. As AI accelerators integrate increasingly expensive GPUs, HBM stacks, and complex interconnect structures, qualified silicon interposer capacity is becoming just as important as packaging assembly capacity. This also creates an interesting opportunity for mature-node foundries. They do not necessarily need to compete with TSMC at the most advanced logic nodes to participate in the AI infrastructure boom. The next phase of advanced packaging competition may be less about who owns the entire process and more about who can build the most reliable, scalable, and geographically diversified supply chain. #TSMC# #GlobalFoundries# #CoWoS# #AdvancedPackaging# #AI# #Semiconductors#

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Advanced Micro Devices’ CEO plans to meet with the head of Samsung Electronics’ semiconductor business on Wednesday, the latest in-person catchup between two of the AI industry’s key figures.