TSMC Arizona’s 1st quarter profit beat its entire 2025 profit, media report, at NT$18.81 billion in the quarter, compared to NT$16.14B for all of 2025. -TSMC Japan (JAMC) turned its 1st ever profit, NT$951M in Q1. -ESMC in Germany losses totaled NT$278M. -TSMC received NT$505M in government subsidies from the US, Japan, Germany in the 1st quarter, down from NT$35.15B last year. $TSM #semiconductors#

TSMC is working hard to maintain its lead over Samsung and Intel, media report, by already preparing for 1nm production at Fab 20 in the Hsinchu Science Park with a 4-phase project (each phase is a new production line). -Fab 20 the vital sub-2nm fab. Phase 1 (P1) and P2 will do 2nm, P3 will do 2nm and A14, with room in P4 for A10 (1nm). The project is already in the hands of its R&D ‘One Team’. -Fab 18 P9 (Tainan) will do 2nm back-end and 3/5nm TSV, with equipment move-in in Q1 2027 and scale up to 25,000 wafers-per-month (wpm) -Fab 22 (Kaohsiung) main 2nm fab, 6 phases. P1 & P2 each 25,000wpm, P3 just started equipment move-in for 2nm, A16; P4 under construction, for N2, A16. -Fab 22 (STSP) P7 construction to start early-2027, will do 2nm and below processes. Has reserved space for future P8 and P9. -Fab 25 (CTSP, Taichung) will host 4-phases for A14, A13, A12 processes, with P1 already under construction, with P2 construction to begin soon, and P3 & P4 already in planning. In advanced packaging: -AP6 plant is expected to reach 10,000 wafers per month capacity by the 3rd quarter, and ramp up phase 3 for CoWoS, SoIC and InFO as well. (Hsinchu) -AP5B plant construction nearly finished, will focus on CoWoS (Taichung) -AP7 plant will be TSMC’s biggest advanced packaging campus, with P1 already packaging Apple chips with WMCM (Wafer-Level Multi-Chip Module) P2 nearly done, with equipment move-in in July, for SoIC for Nvidia. Planning for P3-P7 already underway and will support SoIC and CoPoS. (Chiayi) -AP8 will do CoWoS, with monthly capacity to exceed 40,000 wafers by end-2026, and planning for P2, P3 already started. (Tainan) $TSM $INTC $SSNLF #semiconductors# #semiconductor#

TSMC , the world's largest contract chipmaker, said on Friday it plans to sell up to 152 million shares in Vanguard International Semiconductor via a block trade to financial institutional investors, cutting its stake in the chipmaker.

👀 #TSMC#'s COUPE on Substrate tech is expected to hit mass production in 2H26 — and if #CPO# gains traction in AI servers, #NVIDIA# may look to lock in high-end substrate capacity early via long-term deals. 💡More: 🔗

👀 #TSMC# plans to sell up to 152M Vanguard shares, about an 8.1% stake, as it sharpens focus on core business amid rising capEx — potentially including advanced process, packaging, and global expansion. 💡More: 🔗

🔥 #TSMC# sees the global chip market topping US$1.5T by 2030 and is positioning for a major share, with its #2nm# and A16 chips projected to grow at a 70% CAGR through 2028. 💡More: 🔗

$TSM Confidence Signal TSMC announced it plans to sell up to 152 million shares of Vanguard to focus capital on its core business. You only divest a decades-long strategic position when your own business is more profitable than anything else you could hold. VIS operates in mature nodes. 28nm and above. Decent business. Stable margins. But structurally capped on upside. It is also a confidence signal. You only monetize a long held strategic stake when you are absolutely certain your own pipeline is more valuable than the optionality that stake provided. TSMC held that VIS position for decades. Letting it go now says one thing clearly: the internal roadmap is so capital intensive and so profitable that maintaining a 27% minority position in a partner they no longer sit on the board of is just dead weight on the balance sheet. The timing also matters. TSMC is simultaneously ramping N2 in Taiwan, building fabs in Arizona, Kumamoto, and Dresden, and scaling CoWoS capacity for NVIDIA, Apple, and AMD simultaneously. Capital is not just useful right now. It is urgently needed. So yes. You divest the non-core stake when your own business is generating the kind of returns that make everything else look like a distraction. That is exactly what this is.

Advanced Logic, HBM and Advanced Packaging (CoWoS and CoPos) depends on Applied Materials. TSMC depends on Applied Materials Samsung depends on Applied Materials SK Hynix depends on Applied Materials Intel depends on Applied Materials Terafab depends on Applied Materials See you on the call tomorrow. $AMAT

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