The 2026 OCP APAC Summit content is now available! 🌏 The 2026 OCP APAC Summit brought the global OCP Community together in Taipei to explore the future of open infrastructure for AI, spanning silicon, networking and advanced packaging to power, cooling and data center design. 2026 OCP APAC Summit Highlights Recordings More.pdfPDF Now you can revisit the Summit, catch sessions you missed, or experience the event for the first time with a growing collection of content from Taipei: 🎥 Watch the 2026 OCP APAC Summit Highlight Reel 📑 View and download presentation materials from across the Summit program 📸 Browse the photos from the 2026 OCP APAC Summit And there is a lot to catch up on. This year's Summit welcomed nearly 2,500 registered participants from more than 1,000 organizations and 36 countries, and over 250 speakers, representing more than 60% year-over-year growth. Whether you joined us in Taipei or followed from afar, dive into the ideas, technical insights and open collaboration helping shape the next generation of AI infrastructure. Interested in sponsoring the 2027 OCP APAC Summit? Check out the opportunities here: #OCPSummit# #OCPAPAC# #OpenCompute# #AIInfrastructure# #DataCenters# #OpenInfrastructure# #AI# #Innovation#

🚨 Don't wait! Online registration for the 2026 OCP APAC Summit closes soon. ⏰ Registration closes: 📍 6:00 PM Taipei Time (UTC+8) on August 9 📍 3:00 PM Pacific Time (PDT, UTC-7) on August 9 Join the global open infrastructure community in Taipei, Taiwan, August 11 to 12, for two days of technical innovation, collaboration and insights from leaders across the AI and data center ecosystem. Explore sessions covering: 🔹 AI Clusters & AI Computing Continuum 🔹 Open Data Centers for AI 🔹 Chiplets & Advanced Packaging 🔹 Networking & Photonics 🔹 Advanced Cooling Technologies 🔹 Server, Storage & Memory 🔹 Future Technologies shaping tomorrow's infrastructure Plus, don't miss our co-located workshops from the SONiC Foundation and Arm SystemReady, offering hands-on technical learning and community collaboration. A separate registration is required for the Arm workshop, but the price is included with your registration. Register now and secure your spot before online registration closes! Explore the full schedule and start planning your Summit experience today: And register here: #OCPAPAC26# #OpenCompute# #AIInfrastructure# #OpenHardware# #DataCenters# #AI# #Networking# #Photonics# #Cooling# #Chiplets# #Taiwan#

Join the global OCP Community for two exciting events bringing together the people shaping the future of AI, hyperscale infrastructure, semiconductors, cloud platforms and next-generation data centers. 🇹🇼 2026 OCP APAC Summit 📅 August 11–12, 2026 📍 Taipei City, Taiwan Across two action-packed days, explore the latest technical innovations, connect with experts designing and operating hyperscale infrastructure, and meet organizations from across the data center ecosystem and supply chain. Learn more: 🇰🇷 2026 OCP Korea Tech Day 📅 August 21, 2026 📍 COEX Convention & Exhibition Center, Seoul, South Korea Korea’s dedicated forum for open, data center–focused innovation returns with technical sessions, keynotes and exhibitions covering AI infrastructure, HPC, edge computing, cloud platforms, semiconductors and next-generation data center design. As AI transforms the demands placed on data centers, open standards and collaborative engineering are becoming foundational to performance, efficiency, scalability and sustainable growth. Learn more: Two events. Two dynamic technology hubs. One global community working together to build the future of open infrastructure. We look forward to seeing you in Taipei and Seoul! #OpenComputeProject# #OCP# #OCPAPACSummit# #OCPKoreaTechDay# #DataCenters# #AIInfrastructure# #HPC# #OpenHardware# #CloudComputing# #Semiconductors#

2026 OCP APAC Summit: By the Numbers The 2026 OCP APAC Summit brought nearly 2,500 attendees of the global OCP Community together at TaiNEX2 in Taipei City, Taiwan, on August 11–12, making this year's gathering a tremendous success and demonstrating the continued growth and importance of the OCP Community across the Asia Pacific region. The slides and presentation videos will be ready in the next few days. Read the full story here:

Just some near term events: - OCP APAC tomorrow (Ayar, Lightmatter, $AMD, $NVDA) and your CPO players are giving announcements/updates. This should be a catalyst for certain optical players. - Earnings week: with $ASTS, $RKLB reporting today (space), $LITE on Tuesday (photonics), $NBIS in the middle of the week (Neocloud), and more. - Unitree IPO subscriptions opened up today and Listing is expected this month. Should be a potential catalyst for the humanoid + robotics sector if it opens up well eg. $CCXI. Fun week ahead.

Just some TLDRs of stuff I found interesting: - $SNDK 80% adjusted gross margins projections through 2030, ~75% operating margins and ~50% adjusted FCF margins from investor day. LTAs already 2/3rd of 2028 output. Minimum contracted revenue reaches $93B (MC is currently ~$239B)... Hard to be a cyclical stock when your revenue/targets are expected to continue 4Y later into 2030. - $CRWV signs contracts for 6Y old $NVDA A100 GPUs through 2029. For Neoclouds like Nebius/Iren, this is positive, since it's a counterargument for eg. Burry depreciation short thesis - conventional DRAM gross margins eg. Micron is estimated to reach an unprecedented 95% by 2027, surpassing HBM GMs per UBS read through for legacy/standard dram players like Nanya/Winbond should go brrrr if projections are correct. - Anthropic reportedly achieved 14x+ YoY growth and roughly 2.4x sequential revenue growth q2 to >$11.5B,. estimating growth to $190–200B in 2028r evenue numbers. Your frontier labs keep growing at stupidly fast paces, it would be worrisome if they didnt. - $NVDA reportedly in talks to invest $3B in SB Energy (Softbank subsidiary), creates a >$500B compute financing push with Apollo, BlackRock, Blackstone, Brookfield, Goldman, and others. $NVDA Feynman reportedly moves to TSMC A16 + SoIC + custom HBM + CPO in H2 2028 Just more nvidia news every day - $MSFT Maia 300 discussed $TSM capacity for >300k units in 2027, with expansion to 1m+. Unveils as soon as September. Likely $MRVL should be more happy from this news. For what's happening right now: - maybe GUC for Microsoft current ASIC ramp. - For the Amazon party, stuff like Alchip (I do own shares), likely is ramping now with $AMZN ASIC program H2 2026... So might be a good idea to look at hyperscaler ASIC ramp timelines + their beneficiaries. - $TSM VP of Advanced Packaging stated "the industry is likely to face not only memory shortages but also tight ABF substrate supply over the next few years"... Emphasis on few years for memory + ABF substrates for bottlenecks. Even upstream abf substrate equipment providers are happy, eg. Eternal Precision which uses vacuum lamination equipment stated orders surged, their plants have been running at full capacity, and 20%+ price hikes. - $AMAT expects advanced packaging revenue to grow >70% in 2026, versus prior >50%, and said customer discussions now extend all the way to 2030 (not too familiar with this company, but found their growth rate from 2025 Q4 $6.8B ->$7.01B -> 7.91B -> $9.12B -> $10.25B Q4 2026 projections pretty interesting) - Google said at OCP APAC said conventional 48V is running out of headroom. $NVDA detailed an 800VDC MGX-compatible rack H2 2026 (timeline, Delta / Lite-On beneficaries) - Aside from $SNDK, Nanya LTAs cover 50% of capacity. CXMT signed multi-year DRAM agreements last month, so entire memory industry seems to be following same playbook as ur big 3. - Probe cards remain a bottleneck, MPI(6223) said their probe card capacity remains fully utilized because demand exceeds supply. Already covered the CW laser bottleneck with $AAOI, $SIVE, and $LITE earlier this week, but that's another fun one. - some MLCC/component lead times have hit 36 weeks per Nichidenbo. Your Samsung Electro-Mechanics, Taiyo Yuden, Murata, players should be very happy to hear this. TLDR: AI supply chains go brrr.