Summary of : NAND Pricing Breakout Driven by eSSD ☕️ According to TrendForce, the leading third‑party memory research firm, NAND demand is tracking materially stronger than expected. 📈NAND demand tracking much stronger than expected — driven by eSSD as U.S. CSPs aggressively scale AI infrastructure • WE RAISING NAND blended price outlook meaningfully:
3Q26 / 4Q26 / 1Q27 QoQ: +21% / +17% / +15%
(vs prior +18% / +2% / 0%) • Inventory at U.S. hyperscalers expected to fall further by 4Q26 (from ~14 weeks in July vs ~15-week normal) • Supply remains disciplined: bit growth +15% / +21% / +20% YoY in 2025/26/27 • eSSD demand from U.S. hyperscalers has nearly doubled vs prior projections → demand growth outpacing supply near quarters • enterprise (especially AI-related eSSD) px/demand far outpacing consumer • AI is reshaping the memory hierarchy → new stack: DRAM → SCM → TLC/QLC NAND → HDD • Still bullish DRAM/HBM (SK Hynix, MU) and Now also constructive on NAND names (Samsung, SK Hynix, MU, SanDisk, Phison, etc) #Trendforce# #Memory# #DRAM# #NAND# #MU# #SKHY# #SNDK#

U.S. CSPs are ramping up #eSSD# orders, with demand rising over the past two weeks. QLC products are seeing the strongest growth, with penetration continuing to increase.💡More analysis from #TrendForce#: 🔗

Samsung’s enterprise SSD line just did a memory-cycle print. TrendForce says eSSD sales jumped from $1.9 billion in Q2 2025 to $14.35 billion in Q2 2026. That is more than seven times. Share ticked from 34.6% to 35.1%, still first. The mix is the point. 176-layer QLC volume rose hard. PCIe 5.0’s slice of shipments jumped with it. North American clouds are moving racks from PCIe 4.0 to 5.0. In July Samsung started PCIe 6.0 PM1763, aimed at NVIDIA’s Vera Rubin platform. Omdia puts the whole eSSD market at about $24.1 billion last year and about $154 billion this year, a six-times jump. Agents and bigger data-center builds keep the storage pipe next to the GPU. Samsung is selling the bundle: HBM plus NAND SSDs to the same server buyer. That is why eSSD can print like DRAM this year. Capacity still has to follow price. A seven-times revenue jump on one product line does not last if wafers stay parked on HBM.

KB Securities: the spread of Al agents should structurally increase memory usage across Al data centers-from CPUs and GPUs to HBM, DDR5, and eSSD-as they require far more frequent and sustained inference workloads than conventional generative Al. $AMD $INTC $NVDA $MU $SNDK

$AMGN PHASE 3 SJÖGREN’S TRIAL HITS PRIMARY ENDPOINT Amgen says dazodalibep significantly improved systemic disease activity in patients with moderate-to-severe Sjögren’s disease, with benefits seen as early as Week 4 and sustained through Week 48. The Phase 3 OASIZ 301 trial enrolled about 621 patients and met its primary endpoint based on the ESSDAI disease activity score. There are currently no FDA-approved medicines for Sjögren’s disease. A second Phase 3 study, OASIZ 303, focused on symptomatic Sjögren’s, is expected to complete in Q4.

Per TrendForce data cited in a Bernstein report, global NAND makers have taken a harder line on mobile NAND price hikes in order to bring pricing in line with eSSD, while China's YMTC has not pushed for increases of the same magnitude — allowing it to pick up additional share.

View summary- Akamai–Anthropic deal: 💰 $11.6bn 7-year accelerating CPU agreement announced 24 Sep (potential +$9bn expansion). Anthropic to use Akamai’s distributed AI infra & software for growing CPU workloads. 
🤖 Vera CPUs expected: Nvidia previously flagged Akamai’s Vera deployment plans. Vera targets agentic workloads (code, orchestration, data processing) with high-bandwidth LPDDR5X. 
• Positive read-throughs:
– Server CPU & DRAM demand (agentic AI needs more compute + memory)
– eSSD / NAND (context, vector DB, KV-cache growth; better cost/power vs DRAM/HDD)
– ABF substrates
– Lenovo (major server OEM for Akamai)
• Our Server CPU TAM: 2030 server CPU TAM of $215bn 
• Stocks & Positive Implications :
– CPU: NVDA, AMD, INTC
– Memory: SK Hynix, Micron (DRAM/HBM); Samsung, SK Hynix, MU + SanDisk (NAND)
– Advanced packaging: ASE (Buy), TSMC (Hold), Amkor
– OEM: Lenovo (Buy) #anthropic# #NVDA# #CPU# #DRAM#