At #HotChips2026#, d-Matrix is presenting Raptor™, our 3D DRAM architecture built for the growing memory demands of AI inference. Raptor brings memory closer to compute, delivering massive bandwidth with significantly lower I/O energy than HBM. @ServeTheHome goes inside the architecture and the work behind Raptor: #AIInference# #AIInfrastructure# #3DDRAM# #dMatrix#

A $TSM Spokesperson has reportedly denied exploring 3D DRAM per Tom's Hardware. After a report yesterday from The Information stated TSMC's production plans were from $NVDA's request. The implications would have put TSMC in competition with $MU, SK Hynix, and Samsung and set off narratives about TSm disrupting the biggest memory makers. There's something frustrating with there's market moving headlines both ways. It just creates more confusion and volatility... Especially if something (like $NVDA CEO honeypot allegations) or the TSM report yesterday turns out untrue.

Everyone is looking at $TSM's reported 3D DRAM plans. But I think they're missing the bigger story. Does $NVDA really want TSMC to become a memory manufacturer? Or does NVIDIA want memory suppliers to know they are no longer the only options? HBM is critical to GPU performance, but it's also one of the few areas where NVIDIA depends heavily on external suppliers. Even an alternative manufacturing path that never reaches mass production could eventually change the negotiating dynamics. And the fact that TSMC is reportedly exploring this makes it even more interesting. NVIDIA isn't just designing GPUs anymore. It may be learning to redesign the bargaining power of its entire supply chain. Not exactly comforting news for $MU, $SKHY, and Samsung.

TSMC $TSM pushed back on a report that it is exploring 3D DRAM at Nvidia's $NVDA request, saying it stays focused on logic chips. The tech is still years from market viability, even for Micron $MU, Samsung and SK hynix, and would cost TSMC billions. It could stay in AI memory through HBM base dies and packaging without making DRAM.

MICRON SAYS IT WILL CONTINUE TO BET ON THE 6F-SQUARED STRUCTURE AND NEXT-GENERATION 3D DRAM TECHNOLOGY, WITH ITS CTO SAYING THE COMPANY WILL NOT PURSUE 4F-SQUARED MEMORY CHIPS DESPITE CXMT’S ADVANCE - NIKKEI

$MU $SKHY Memory Innovation Is Just Getting Started. 3D DRAM Incoming. "SK hynix is reportedly stepping up development of 3D $DRAM, a next-generation memory technology for on-device AI. … the company has reportedly begun recruiting 3D-Stacked DRAM-on-Logic Design Engineers through its U.S. subsidiary in San Jose, California. SK hynix is also said to have partnered with a specific customer to develop applications for the technology.” “SK hynix President and Chief Development Officer (CDO) Hyun Ahn said AI development is increasingly constrained by memory bottlenecks, requiring new memory architectures beyond incremental improvements. He said the company is working with TSMC to apply its advanced logic process to HBM4 base dies, with plans to expand the technology to High Bandwidth Flash (HBF) and 3D-Stacked DRAM-on-Logic to further integrate memory and logic for higher performance and power efficiency.” It's not just SK Hynix. I've talked to my buddies in the industry. Micron and Samsung are actively R&Ding on 3D DRAM. This product is going to be perfect for AI Inference.