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AMD, TSMC and OSAT Channel Check: 1. AMD's AI GPU production (MI455/MI450) is expected to remain 100% at TSMC CoWoS in 2027. Production estimates land at a mid-point of 600k units for both SKUs next year per recent MS forecasts. 2. While ASE and Amkor still lead OSAT capacity, their capacity ramps are rumoured to be progressing slower than expected. This means that TSMC may be required to support CoWoS-L wafers for AMD's Venice CPU prodction which would further constrain internal capacity for MI455/MI450 production. Per MS, this would equate to TSMC supporting ~80k CoWoS-L for Venice production. $AMD $TSM $AMKR $ASX

Missed this mention earlier but IC design insiders reveal that OSAT providers have already warned clients: "traditional packaging capacity could face a deficit exceeding 20% by 2027" (eg. $AMKR, ethereum:0x041ff0e49f6f774e7dc7bd10ee4a14c00b1d80b2, Powertech as potential beneficaries) With: "wire bonding equipment" emerging as the primary bottleneck (ASMPT, $KLIC) -> influx of AI server shipments has triggered a spike in demand for mature chips -> existing mature packaging capacity at OSATs is being rapidly absorbed -> securing early access to traditional packaging capacity is now becoming a challenge Cascading bottleneck patterns are occurring across memory (eg. DDR2, DDR3) and now packaging capacity I guess.

Taiwan’s ‘Big 5’ chip packaging and testing firms (OSATs) will spend over NT$460 billion (US$14.4B) this year on capex in a bid to catch up with AI-related demand, media report. Industry giant ASE said its biggest problem now is how to accelerate construction, equipment installation, and capacity rollout at 13 new projects and 8 renovations: ASE: NT$335 billion (US$10.5B) Powertech: NT$50 billion KYEC: NT$50 billion Sigurd Group: NT$20 billion ChipMOS: NT$7.2 billion in the 1st half. More coming $ASML $AMAT $TER $CAMT $NVMI #BESI# #Advantest#

#AI# chips are driving up testing demand. Taiwan #OSAT# Sigurd says customers are locking in long-term deals, with some memory players even paying premiums to secure capacity. 💡More: 🔗

$NVDA is prepaying for test capacity! KYEC is just the OSAT (foundry/testing house)—do your own DD on who actually supplies the equipment! 👀 $NVDA Prepayment Deal Backs $2449.TW’s US Testing Expansion KYEC (京元電子） announced that its board had approved a customer prepayment agreement with $NVDA, according to MoneyDJ. The testing company and its wholly owned US subsidiary, AeternZ, will build and reserve US testing capacity for the customer. The advance will be offset against future testing fees. That ties customer funding directly to capacity expansion: $2449.TW gains upfront financial support, while $NVDA secures access to future testing services. The agreement supports the US buildout rather than leaving the testing company to fund it entirely on its own. Sources

It was wonderful being back in Sanand to inaugurate the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility. This will add momentum to our efforts in making India a hub for semiconductors and futuristic technologies.