Advanced Micro Devices $AMD is in positive gamma into Nov 6 earnings after hours, with GEX ratio at 0.80 (+0.8σ) and net GEX at 34.1K. Net premium is +$6.2M and flow ratio is 0.53 (+1.5σ), with zero gamma at 497.61 and the largest call OI stacked at 600.

"Advanced Bounty: Area Patrol" Event Details Event Duration 2026/11/04 04:00 (server time) – 2026/11/09 03:59 (server time) Requirements Reach Inter-Knot Lv. 21, complete the Reputation Rank-Up Mission "Path of the Proxy I", and unlock Area Patrol to participate Event Details • During the "Advanced Bounty: Area Patrol" event, Proxies can go into Area Patrol and clear any stage to obtain double rewards! • During the event, 2 challenges will be buffed each day. Buffs will be reset daily at 04:00 (server time). #zzzero# #zenlesszonezero#

Advancing AI should not require a trade-off between pausing innovation or moving forward without guardrails, according to @DavidSolomon, Chairman and CEO of Goldman Sachs. He discusses a more nuanced approach—one that unlocks innovation while establishing controls and accountability. Listen on Exchanges:

Advancing digital freedom together 🧩🧩🧩 Thank you for helping the ecosystem @ethswarm, @Zcash, @Logos_network, @intmaxIO, @protocollabs, @radicle, @GnosisVPN, @ConsensysAudits, @fatsolutionsxyz, @theInterfold, @zERC20io, @ensdomains, @0xprivacypools, @cakewallet, @ShutterNetwork

#AdvancedPackaging#: TSMC says nobody else is in production at 5X reticle size — and C.C. Wei hints TSMC will step in if EMIB-T falls short From TSMC's 3Q26 #EarningsWatch# call (10/15), the CoWoS, Intel EMIB-T and GlobalFoundries exchanges in the speakers' own words: 🔹 Q (Charlie Chan, Morgan Stanley): "From what we're seeing, the reticle size is getting much bigger. … If some customer, they initially choose to use Intel's EMIB-T, and for some reason cannot get to sufficient demand, are you okay to bail out or support customers for the CoWoS version or capacity?" A (C.C. Wei, Chairman & CEO, TSMC): "So far, let me share with you today's situation. We are in the real-world production of 5X reticle size. I don't believe that anybody can do that today except TSMC, and the yield is excellent. So our customers are very satisfied with the result. And then we are working on the 9X reticle size and moving into the 14X reticle size. … But so far, CoWoS is still the number one choice for our customer. As time goes by, yes, our competitor offers a very competitive solution." 🔹 Backup plan? Jeff Su, TSMC IR: "If the competitor cannot deliver on their solution … will you be willing to be something like a backup plan?" C.C. Wei: "I try to avoid to answer it directly, but let me say that, yes, we will be. … Okay? And that gives you enough hint." 🔹 Q (Sahith Singh, Stifel Financial): "There was the announcement via GlobalFoundries that they would be providing silicon interposers to TSMC. And so I would love some color into how you're thinking through these strategic decisions in terms of procuring from some of the specialty foundries versus providing in-house." A (C.C. Wei): "We designed a deal with GlobalFoundries, and this is part of our overall strategy in the back-end supply. … Definitely, we have a little bit shortage on the back end, and we would like to work with our so-called partner with GlobalFoundries so that both TSMC and GlobalFoundries can support TSMC's customer for their product to be introduced with enough support on the capacity." 💡More: 🔗 $TSM $INTC $GFS

Advanced packaging is no longer just about adding CoWoS capacity. It is becoming a global manufacturing ecosystem. TSMC’s reported $2 billion, five-year manufacturing agreement with GlobalFoundries highlights an important shift in the AI semiconductor supply chain. Under the agreement, GlobalFoundries is expected to manufacture silicon interposers for TSMC at its Malta, New York facility, with production ramping up in 2028. The significance goes beyond geographic diversification. As AI accelerators integrate increasingly expensive GPUs, HBM stacks, and complex interconnect structures, qualified silicon interposer capacity is becoming just as important as packaging assembly capacity. This also creates an interesting opportunity for mature-node foundries. They do not necessarily need to compete with TSMC at the most advanced logic nodes to participate in the AI infrastructure boom. The next phase of advanced packaging competition may be less about who owns the entire process and more about who can build the most reliable, scalable, and geographically diversified supply chain. #TSMC# #GlobalFoundries# #CoWoS# #AdvancedPackaging# #AI# #Semiconductors#

Advancing semiconductor innovation in Oregon. Congratulations to @LamResearch on its new Tualatin R&D lab. We look forward to building on our decades-long collaboration to accelerate process development for the AI era. #IntelFoundry# #NationalManufacturingWeek#