✨At #FMS2026#, @SKhynix showcased its vision for next-generation AI memory through Tiered Memory. From #HBM# and #DRAM# to #NAND#, #SSD#, #CXL#, and #HBF#, we're building a full-stack memory portfolio to power the next wave of AI. 🔗 #SKhynix# #FMS#

At #FMS2026#, @SKhynix unveiled the first standard specifications for High Bandwidth Flash (#HBF#) with @SanDisk through @OpenComputePrj (#OCP#), alongside its vision for Tiered Memory. Learn more 👇 #SKhynix# #Semiconductor#

$SNDK launch of HBF memory This weekend, FMS 2026 (Future of Memory and Storage) unofficially started in Santa Clara, California, where SanDisk and $SKHY held presentations for industry experts, engineers, and analysts. There they presented their new HBF memory. What is HBF? HBF is the solution before the memory wall within AI data centers. HBM (DRAM): Extremely fast, but has very low storage capacity and is gigantically expensive. Thoughts? eSSD (NAND): Gigantic storage capacity at a low price, but too slow to be fed directly to GPUs during ongoing AI computations. HBF (New category): Combines the capacity from NAND with the parallelism from HBM. It allows AI servers to keep enormous language models, KV-cache, and RAG databases active in memory at a fraction of the power consumption and cost of DRAM. What it does: 50–70 % lower TCO (Total Cost of Ownership): Which includes reduced production cost per generated token by up to 50 % to 75 % compared to a pure HBM/DRAM infrastructure. 60–70 % lower power consumption with significantly lower cooling requirements. Conversation context becomes longer: Unlimited KV-cache: Enables enormous context windows which includes remembering entire books, codebases, and long conversation histories without performance degradation or memory crashes. 10–20x higher concurrency: A single server can serve significantly more parallel users and AI agents simultaneously. New higher price target: This has been developed in collaboration with SK Hynix but SanDisk will be 6 months ahead with this technology. HBF will probably be presented at their next Q report which will adjust future free cash flows and give a significantly higher price target. I believe we will see an explosive rise of SNDK when HBF is presented.

／ 🎼.• #まいすて出演情報# 🎼.• ＼ 🗓️11/14(土) SPA! FES2026 📍Spotify O-WEST / duo MUSIC EXCHANGE / SHIBUYA RING 🕰️OPEN 11:00 / START 11:45 🎟️TICKET 🎁1pt / My_Stage CARD×2 #My_Stage#

AI agents are accelerating decisions and creating new data-intensive workloads, increasing the need for high-performance memory at the edge and scalable storage in the data center. At FMS 2026, Micron was recognized with three awards for innovations built to meet those demands:​ 🏆 Best of Show Award: 245TB​ Micron 6600 ION SSD 🌱 Sustainability Award: 245TB​ Micron 6600 ION SSD 💻 User Implementation Award: Micron LPCAMM2​ See the solutions driving the future of memory and storage from cloud to edge:

AI agents will soon outnumber the global human population, leading to an era where AI agents primarily interact with and query other AI systems rather than humans. This surge in AI-generated requests will demand much faster database and application processing, requiring broader computing architecture innovations. As a result, the value of memory chips is expected to move away from pure storage capacity (price per GB) toward processing performance, speed, and efficiency, especially the ability to handle rapid data access and token generation for AI inference workloads. Panelists from Samsung, Micron, SK Hynix, and others highlighted the limits of HBM alone and the rise of hierarchical/hybrid memory architectures that combine HBM, DRAM, and high-bandwidth NAND flash (HBF). The overall market is seen shifting from training-centric to inference-centric AI, making high-capacity, high-speed memory solutions increasingly critical. -FMS 2026 Event in Santa Clara, California. $MU $SKHY $DRAM $CRWD $NET $LITE