Packaging Innovations & Empack 2027 is open for registration! Returning to NEC Birmingham on 24–25 February, the event will focus on turning big ideas into practical packaging solutions. What's new for 2027? 🔗 #PackagingNews# #PackagingInnovations#

Packaging Innovations & Empack 2027 is open for registration! Returning to NEC Birmingham on 24–25 February, the event will focus on turning big ideas into practical packaging solutions. What's new for 2027? 🔗 #PackagingNews# #PackagingInnovations#

PACKAGING CORP OF AMERICA $PKG Q3’26 EARNINGS HIGHLIGHTS 🔹 Revenue: $2.60B (Est. $2.61B) 🔴; vs $2.31B LY 🔹 Adj. EPS: $3.04 (Est. $2.92) 🟢; vs $2.73 LY 🔹 Adj. EBITDA: $577.2M (Est. $566M) 🟢 Q4 Guide: 🔹 Adj. EPS: $2.81 (Est. $2.78) 🟢 Segment Sales: 🔹 Packaging: $2.41B; vs $2.13B LY 🔹 Paper: $163.2M; vs $161.2M LY Segment Operating Income (ex. Special Items): 🔹 Packaging: $407.7M; vs $347.9M LY 🔹 Paper: $29.0M; vs $35.6M LY Other Q3 Metrics: 🔹 GAAP EPS: $2.93; vs $2.51 LY 🔹 GAAP Net Income: $262.3M; vs $226.9M LY 🔹 Total Corrugated Shipments: +10.6% per day 🔹 Legacy Corrugated Shipments: -0.5% per day 🔹 Paper Sales Volume: -2.5% YoY 🔹 Capital Spending: $247.3M Key Updates: 🔹 Facilities closure and other costs: $6.2M ($0.05/share) 🔹 Acquisition and integration-related costs: $3.0M ($0.03/share) 🔹 Corrugated products facility fire: $3.0M ($0.03/share) 🔹 Wallula mill restructuring: $0.3M (-/share) 🔹 Earnings were $.13 above third quarter guidance of $2.91 per share 🔹 Earnings from the acquired Greif operations: $.13 per share Comments: 🔸 “Our mills ran at full capacity during the quarter, and we are meaningfully realizing production benefits from projects at our Jackson mill as well as improved operating performance at the acquired Greif mills.”

Packaging Innovations & Empack 2027 is open for registration! Returning to NEC Birmingham on 24–25 February, the event will focus on turning big ideas into practical packaging solutions. What's new for 2027? 🔗 #PackagingNews# #PackagingInnovations#

Less packaging waste, smarter fulfilment! IKEA invests £31.5m in UK automation & sustainability. Read more 🔗 #PackagingNews# #IKEA# #SustainablePackaging# #PackagingInnovation# #Automation# #Ecommerce#

Chip-packaging bottlenecks are spreading beyond AI, GF Securities says. Its supply-chain checks point to tight packaging capacity for analog chips, with lead times up more than 30% and unfilled orders rising. GF expects prices for flip-chip, wire-bond and QFN packaging to rise 10% to 80% in H2 2026, with increases of 10% to 20% for CoWoS. Taiwan’s Economic Daily News reported on Oct. 13 that OSAT prices had already risen 10% to 30%. For ASE Technology $ASX, GF expects leading-edge advanced packaging to account for 32% of packaging and testing revenue in 2027, up from 23% in 2026. The firm raised its price target to NT$843 from NT$754.

A packaging error caused a recall of Skinny Crunch Light Peanut Butter Bars at Sainsbury's and Asda. #PackagingNews# #Packaging# #FoodPackaging# #FoodSafety# #ProductRecall# #Labelling# #Retail#

Advanced packaging is no longer just about adding CoWoS capacity. It is becoming a global manufacturing ecosystem. TSMC’s reported $2 billion, five-year manufacturing agreement with GlobalFoundries highlights an important shift in the AI semiconductor supply chain. Under the agreement, GlobalFoundries is expected to manufacture silicon interposers for TSMC at its Malta, New York facility, with production ramping up in 2028. The significance goes beyond geographic diversification. As AI accelerators integrate increasingly expensive GPUs, HBM stacks, and complex interconnect structures, qualified silicon interposer capacity is becoming just as important as packaging assembly capacity. This also creates an interesting opportunity for mature-node foundries. They do not necessarily need to compete with TSMC at the most advanced logic nodes to participate in the AI infrastructure boom. The next phase of advanced packaging competition may be less about who owns the entire process and more about who can build the most reliable, scalable, and geographically diversified supply chain. #TSMC# #GlobalFoundries# #CoWoS# #AdvancedPackaging# #AI# #Semiconductors#